The devices being x-rayed can be moved around inside the x-ray enclosure. This is achieved by
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clamping the sample in a robotic manipulator. The manipulator basically moves the sample left,
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right, front, back, up and down. Most manipulator systems also include a tilt and rotate feature
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that is exceptionally helpful in diagnosing BGA type problems. The motion of the robotic unit is
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controlled via two large joystics mounted on the right side of the system cabinet. Magnification of
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the sample is achieved by moving the device closer to the x-ray tubehead. Some systems also
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allow the detection device (image intensifier) to be moved farther away from the tube which also
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increases magnification.
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These types of X-Ray systems are capable of a spatial resolution down to approximately 3um
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(microns). Such high resolution capabilities enable electronic semiconductor manufacturers to
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be able to diagnose failures that occur inside micro electronic devices. Detecting failures in a
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device that has been classified as defective is called "Failure Analysis". X-Ray is an extremely
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valuable failure analysis tool because it is non-destructive to the sample. Other forms of failure
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analysis consist of actually cutting into the devices or acid etching away encapsulation materials
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to reveal the source of the failure.
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Working in this field is extremely rewarding because in my opinion X-Ray is unique. These
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systems are complicated and in order to be effective in their repair one must have an extensive
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background in this field. I have been working on Microfocus X-Ray systems now for over 7 years
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and I am looking forward to continuing my work in this exciting field.
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